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Provide customers with total solutions for grinding and polishing
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PRODUCTS
Diamond Liquid and Carrier
Diamond Slurry and Carrier
Silicon carbide wafer multi-wire cutting slurry
This product is mainly used for multi-wire cutting of silicon carbide crystals.
Silicon Carbide Lapping Slurry
This product is mainly used for coarse grinding and thinning of silicon carbide wafers.
This product is mainly used for thinning of super hard materials such as sapphire substrate.
Metal Processing Lapping Slurry
This product is mainly used for polishing the metal material of piston ring den.
This product is used for multi-wire cutting of silicon carbide crystals after adding cutting powder specially for silicon carbide.
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