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Polishing Pad
Porosity has good storage performance for the polishing slurry and maintains the stability of polishing efficiency.
Product characteristics：
(1)Made of polyurethane resin, with strong wear resistance and porosity;
(2)Abrasion resistance enables the polishing pad to maintain excellent flatness
(3)Porosity has good storage performance for the polishing slurry and maintains the stability of polishing efficiency.
Product Specifications：
| Type | Density (LB/FT3) | Hardness |
| SL-4387 | 68 | SHORE D 69 |
| LP-57C | 33 | SHORE A 88 |
| SP-66C | 28 | SHORE D 36 |
Remarks:
(1)The minimum thickness of grooved polishing pad is 1mm;
(2)The standard groove depth is 1/2 of the thickness of the polishing pad;
(3)It can be customized for different slotting requirements.
Application fields：
Widely used for high-speed plane polishing of silicon carbide wafer, sapphire wafer, silicon wafer, ceramic material, metals and alloy, hard disk and other products.
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