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Diamond Liquid and Carrier

Sapphire Lapping Slurry

This product is mainly used for thinning of super hard materials such as sapphire substrate.

Product Type	Size specification	Abrasive Type	Characteristic
DPP-Sapp	D50=4-6μm	Poly/polycrystalline-like diamond	Easy to shake, alcohol-based carrier, oil-based carrier
DPAL-Sapp	D50=30-40μm	polycrystalline-like diamond	Easy to shake, alcohol-based carrier

Special requirements can be tailor-made.

(1)The product is matched with resin copper plate to achieve high removal rate of sapphire wafer and ensure the surface quality of wafer;

(2)Good cleaning performance and more environmentally friendly;

(3)Strict quality control to ensure the consistency and stability of product quality;

(4)The diamond grain size can be adjusted according to customers’ requirements.

We are happy to share our knowledge with you and are always happy to ask any further questions you may have.

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