Henan Union Precision Material Co., Ltd.,

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Aggregated diamond

Aggregated diamond is a spherical polycrystalline-like diamond powder, which have unique polycrystalline-like structure and widely used in grinding and polishing of hard and brittle materials such as sapphire wafers, silicon carbide wafers and functional ceramics.

团料金刚石

Product Features

★ Composed of fine treated diamond particles and special binder, with polycrystalline like structure

★ Spherical abrasive prepared by special process, rounded shape, small cutting edge, not easy to cause deep scratches to the workpiece being processed

★ Isotropic properties of polycrystalline diamond, no fixed dissociation surface, good abrasion resistance of particles

★ Spherical particles with consistent internal and external structure, good self-sharpening, stable cutting force

Product Line

Available specifications

Specification	0.2um	0.7um	1.5um	4um	9um
Average particle size	20-30um	25-35um	30-40um	30-40um	40-60um

Note: The table is conventional particle size, other particle size products can be provided according to customer requirements.

Applications

★ Diamond lapping solution with abrasive skins for processing sapphire wafers, silicon carbide wafers, functional ceramics and other hard and brittle materials, suitable specifications and particle sizes can be selected according to specific requirements

★ Diamond grinding pad with cutting fluid for processing microcrystalline glass cover, sapphire wafer, silicon carbide wafer and other hard and brittle materials, according to specific requirements to choose the appropriate specifications and particle size

key word:

Aggregated diamond