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Polishing Slurry

Nano diamond slurry

(1)Polishing of semiconductor wafer: monocrystalline silicon wafer, polycrystalline silicon wafer, sapphire wafer, silicon carbide wafer, etc.;

(2)Polishing of magnetic recording materials: computer hard disk substrate, computer hard disk head, etc.

Special requirements can be tailor-made.

(1)The unique super dispersion technology makes the product have good dispersion effect;

(2)It can achieve angstrom surface processing effect.

(1)Processing of semiconductor wafer: mainly including sapphire substrate, silicon carbide wafer, sapphire window wafer, etc.;

(2)processing of ceramic material: zirconia fingerprint identification sheet, zirconia ceramic phone back cover and other functional ceramics;

(3)Processing of other materials: optical glass, metal materials, hard alloy, etc.

Special requirements can be tailor-made.

(1)Uniform particle size, high polishing efficiency;

(2)The surface roughness of polished wafer Ra<0.2 nm.

We are happy to share our knowledge with you and are always happy to ask any further questions you may have.

Industry Experts

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Technical support