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Polycrystalline-like diamond powder
The particle shape is porous structure, and the surface has a large number of sharp cutting edges. After grinding and polishing, the surface Ra value is significantly reduced, which is widely used in precision grinding and polishing of hard and brittle materials, such as sapphire, silicon carbide crystal and ceramic materials.
Characteristics
★ Strong cutting force: the particle surface has a large number of sharp cutting edge, the cutting force can reach 2-4 times of the monocrystalline diamond powder
★ High polishing accuracy: the surface cutting edge of monocrystalline diamond powder particles is large and hard, easy to produce deep scratches, the QPD diamond powder particle surface cutting edge is small, the hardness is low, and the surface Ra value of the workpiece is significantly reduced after polishing.
★ Strong holding force: The particle surface is rough and binds more firmly with the binder, which can significantly enhance the holding force of abrasive in various diamond products and improve the service life.
Available sizes
2-4 | 3-6 | 4-8 | 5-10 | 6-12 | 8-16 | 10-20 | 15-25 | 20-30 | 22-36 | 30-40 | 36-54 |
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Remarks: Special requirements can be tailor-made.
Applications
★ Polishing and lapping of SiC and sapphire wafer
★ Polishing and lapping of ceramic materials
★ Precision polishing and lapping of stainless steel, aluminum alloy and other metal materials
key word:
Polycrystalline-like diamond powder
Adamantite
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