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Semiconductor packaging

Semiconductor packaging


In semiconductor packaging, a ceramic substrate is a special process plate in which copper foil is bonded to the surface of the ceramic substrate direcly (single or double-sided) at high temperature. The mainly types include Beryllium Oxide (BeO), Alumina (Al2O3) and Aluminum Nitride (AlN), Silicon Nitride (Si3N4).

characteristic:

1. Strong mechanical stress and stable shape;

2. Excellent thermal cycle performance, cycle times up to 550,000, high reliability;

3. Same with PCB board ((or IMS substrate)) can be etched out of a variety of graphic structure;

4. No pollution and pollution-free;

5. Wide temperature range -55℃~850℃;

6. Thermal expansion coefficient is close to silicon, simplifying the production process of power module.

Processing process:

半导体封装

Ceramic substrate rough grinding process effect

Diamond Pad Specifications Rough grinding diamond pads for ceramics
Processing results Processing data
Removal rate(um/min) 10-15
RoughnessRa(um) <0.6

Ceramic substrate rough grinding process effect

Diamond Pad Specifications Rough grinding diamond pads for ceramics
Processing results Processing data
Removal rate(um/min) 7-10
RoughnessRa(um) <0.4

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