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Monocrystalline Diamond Powder

Using high-grade and high-strength diamond as raw materials, it inherits many advantages of the raw materials itself. The particles internal impurities are very low, low magnetism, highe wear resistance and high impact resistance, with mature technology and standards to produce the blocky and sharp products, which perfectly combines the indexes of high efficiency and long service life. The strictly controlled grading production process makes the particle size distribution of the products concentrated, preferably remove the ineffective fine particles and the coarse particles that are easy to cause scratches, greatly increase the proportion of effective grinding particles, improve the processing efficiency of the workpiece, and reduce the defect rate.

单晶金刚石微粉

Monocrystalline diamond powder, selects high quality synthetic diamond as the raw material, adpots different production processes and product standards according to the requirements of different industries and application fields.

Micron Diamond Powder Special for Diamond Wire/ SiC crystal Cutting

Product Characteristics

Applications

Suitable for all kinds of high-precision electroplating diamond wire, electroplating diamond grinding wheel, SiC crystal cutting, cutting tools, ultra-thin saw blade, etc.

Micron Diamond Powder Special for PCD/PDC

Product Characteristics

Using high-grade, high-strength diamond as the raw materials, it inherits many advantages of the raw materials itself. particles internal impurities are very low, ,low magnetism, highe wear resistance and high impact resistance, ensure that each particle of the product is regular shape,No strip, flake irregular shape,remove the oversize particles, the single element surface purity is <5ppm , good dispersion performance.

Applications

Suitable for PDC/PCD cutter, TSP and metal bond products, ceramic bond products, electroplating diamond products, etc.

Micron Diamond Powder Special for Electroplating Products

Product Characteristics

Using high-grade, high-strength diamond as the raw materials, according to the characteristics and processing requirements of hard and brittle materials, special shaping technology for particle rounding, roughening treatment, ensure that each particle is rounded and regular, without protruding edges and corners, the rough surface significantly enhances the holding force of the workpiece,round shape can effectively avoid the edge breakage and scratches in the processing of hard and brittle materials.

Applications

Suitable for the electroplating diamond tools which is special used for the processing of hard and brittle materials , grinding wheels, etc.

For some specific use areas, on the basis of conventional products, further processing to better meet the specific requirements of these specific industries.

Characteristics

Fine sizes products developed specifically for the high-end polishing field. The traditional shaping and grading technology can not effectively shape and grade the fine particles below 1micron, so there are a large number of irregular and oversize particles in the conventional products, which is the core factor leading to the poor polishing effect of ultra-fine micron diamond powder, Our company has broken through the technical barriers of fine-grained diamond shaping and grading, which can effectively shape and grade diamond particles as low as 50 nm to ensure the concentration of product particles, completely remove irregular and oversized particles, and ensure that no deep scratches will be caused in the polishing process.

Applications

Suitable for high-end precision gems, lenses, metallographic consumables, LCD panel, LCD glass, sapphire, quartz sheet, LED sapphire substrate, ceramic materials and other precision lapping and polishing.

Available specifications

Specification	D50 （μm）	Wire saw micro powder	SiC crystal cut micronized powder	Composite flake micro powder	Plating tool micronized powder	More
Specification	D50 （μm）	Wire saw micro powder	SiC crystal cut micronized powder	Composite flake micro powder	Plating tool micronized powder	More
0-0.05	0.05					√
0-0.08	0.08					√
0-0.1	0.1					√
0-0.25	0.2					√
0-0.5	0.3					√
0-1	0.5					√
0.5-1.5	0.8					√
0-2	1					√
1-2	1.4					√
1-3	1.8			√		√
2-4	2.5			√		√
3-6	3.5			√		√
4-8	5	√	√	√		√
5-10	6.5	√	√	√		√
6-12	8.5	√	√	√		√
8-12	10	√	√	√	√	√
8-16	12	√		√	√	√
10-20	15	√		√	√	√
15-25	18	√		√	√	√
20-30	22	√		√	√	√
20-40	26	√		√	√	√
30-40	30	√		√	√	√
40-60	40	√		√	√	√
50-70	50	√		√	√	√
60-80	60	√		√	√	√