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Lapping Pad and Grinding Wheel
Lapping pad and Grinding Wheel
Diamond Lapping pad belongs to the category of consolidated abrasive grinding technology. Based on a specially designed pad structure, it is made of diamond powder and resin, and can be used in the lapping and thinning process of hard and brittle materials such as glass substrates (microcrystalline, quartz, borosilicate, white board, sapphire), semiconductor wafers (monocrystalline silicon, silicon carbide), piezoelectric terminals (lithium tantalate), and precision ceramics (aluminum oxide, aluminum nitride, silicon nitride).
According to the type of bond, Union Precision series grinding wheel products are divided into resin bond grinding wheel, vitrified bond grinding wheel and metal bond grinding wheel; According to the shape or application field of the grinding wheel, it can be divided into centerless grinding wheel, grinding wheel for CNC tool grinder, grinding wheel for PCD and other series, which are used in the processing fields of hard alloy, ceramics, magnetic materials, crystals, stainless steel bars, PCD, PCBN and other materials.
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