Third generation semiconductor
The third generation semiconductor devices have excellent thermal and electrical conductivity, and have a wide application prospect in the field of high temperature, high frequency, high power and radiation resistance integrated electronic devices
In semiconductor packaging, a ceramic substrate is a special process plate in which copper foil is bonded to the surface of the ceramic substrate direcly (single or double-sided) at high temperature. The mainly types include Beryllium Oxide (BeO), Alumina (Al2O3) and Aluminum Nitride (AlN), Silicon Nitride (Si3N4).
The market demand of consumer electronics products continues to grow, which has promoted the rapid development of China's consumer electronics industry. At present, China has become the frontier market of global consumer electronics products, and the scale of production and sales ranks in the top of the world.
LED can convert electrical energy into light energy efficiently and are widely used in lighting, flat-panel displays, medical devices and other fields.
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