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Silicon carbide wafer multi-wire cutting slurry

Silicon carbide wafer multi-wire cutting slurry

碳化硅切割液


Silicon carbide wafer multi-wire cutting slurry

1. Application fields

This product is mainly used for multi-wire cutting of silicon carbide crystals.

2. Product Specifications

Product Type Particle Size Abrasive Type Density Properties
DPSS-SiC D50=4-6μm Mono diamond 0.9-1.1 g/cm3 Alcohol-based carrier, oil-based carrier
D50=7-12μm Mono diamond 0.9-1.1 g/cm3 Alcohol-based carrier, oil-based carrier

Special requirements can be tailor-made.

3. Product characteristics

(1) The product has good adhesion to the cutting line during the cutting process;

(2) High cutting efficiency;

(3) The formula has good anti-rust performance;

(4) Alcohol-based cutting slurry is more environmentally friendly and easy to clean;

(5) Good suspension of diamond abrasive;

(6) Strict quality control to ensure the consistency and stability of product quality.


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