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Diamond Liquid and Carrier

Silicon carbide wafer multi-wire cutting slurry

碳化硅切割液

This product is mainly used for multi-wire cutting of silicon carbide crystals.

Product Type	Particle Size	Abrasive Type	Density	Properties
DPSS-SiC	D50=4-6μm	Mono diamond	0.9-1.1 g/cm3	Alcohol-based carrier, oil-based carrier
DPSS-SiC	D50=7-12μm	Mono diamond	0.9-1.1 g/cm3	Alcohol-based carrier, oil-based carrier

Special requirements can be tailor-made.

(1) The product has good adhesion to the cutting line during the cutting process;

(2) High cutting efficiency;

(3) The formula has good anti-rust performance;

(4) Alcohol-based cutting slurry is more environmentally friendly and easy to clean;

(5) Good suspension of diamond abrasive;

(6) Strict quality control to ensure the consistency and stability of product quality.

We are happy to share our knowledge with you and are always happy to ask any further questions you may have.

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