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PRODUCTS
Diamond Liquid and Carrier
Silicon carbide wafer multi-wire cutting slurry
Silicon carbide wafer multi-wire cutting slurry
1. Application fields
This product is mainly used for multi-wire cutting of silicon carbide crystals.
2. Product Specifications
Product Type | Particle Size | Abrasive Type | Density | Properties |
DPSS-SiC | D50=4-6μm | Mono diamond | 0.9-1.1 g/cm3 | Alcohol-based carrier, oil-based carrier |
D50=7-12μm | Mono diamond | 0.9-1.1 g/cm3 | Alcohol-based carrier, oil-based carrier |
Special requirements can be tailor-made.
3. Product characteristics
(1) The product has good adhesion to the cutting line during the cutting process;
(2) High cutting efficiency;
(3) The formula has good anti-rust performance;
(4) Alcohol-based cutting slurry is more environmentally friendly and easy to clean;
(5) Good suspension of diamond abrasive;
(6) Strict quality control to ensure the consistency and stability of product quality.
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