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Micron Diamond Powder
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Micron Diamond Powder

For the monocrystalline diamond micropowder, the high-quality artificial diamond is taken as the raw material, and their production process and product standard are formulated according to the requirement of different industries and application fields respectively and actually executed.
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For the monocrystalline diamond micropowder, the high-quality artificial diamond is taken as the raw material, and their production process and product standard are formulated according to the requirement of different industries and application fields respectively and actually executed.

  

单晶金刚石微粉

 

  SEM report of monocrystalline diamond micropowder

  

单晶金刚石微粉

PSD picture of monocrystalline diamond micropowder

EDP series

Product characteristics:

It is suitable for the application field having requirement for rapid processing, and relatively low-intensity raw materials, so as to ensure that the product has good self-sharpening and meets the customer requirement to processing efficiency, and meanwhile, the product keeps the higher price competitiveness due to the strict control of raw material and processing cost on the premise of meeting the usage requirement.

Application field:

Stone processing tools, ceramic processing tools, resin bonded abrasion block, resin bonded grinding wheel, etc.

●CDP series

Product characteristics:

The product is produced in accordance with the general standard of traditional application field, so as to ensure that the various indexes that the customer pays the most attention to can meet the requirement: the particle size distribution and purity conform to the industrial standard, the particle shape is good, and the oversize particles are removed, therefore, it is the economic substitute of FDP product in the traditional application field.

Application field:

Traditional saw cutting, cutting, grinding, polishing, diamond products, etc.

单晶金刚石微粉

 

●FDP series

Product characteristics:

Based on the CDP long-life products, this product is subjected to the post-treatment processing with many methods to ensure that each particle has regular crystalline form and has no strips and flakiness particles., thereby removing the oversize particle more thoroughly; and moreover, the purity of surface reaches Level ppm, and the dispersion performance is good.

Application field:

Traditionally saw cutting, cutting, grinding, polishing, and the high-precision cutting, grinding and polishing with a specific range. Moreover, it can be used as raw material of various diamond tool tool, diamond paste and diamond slurry.

单晶金刚石微粉

 

●HDP series

Product characteristics:

With adoption of high-grade and high-strength diamond raw material, it inherits many advantages of raw materials. The particles have very low internal impurities, low magnetism, high wear resistance and impact resistance. By cooperating with the mature FPD process and standard production, the indexes, such as high efficiency and long life, are perfectly combined.

Application field:

High –end PDC, TSP, metal bond products, vitrified bond products and electroplated diamond products, etc.

  

单晶金刚石微粉

 

●SFDP series

Product characteristics:

With regard to some specific usage fields, deep processing is carried out based on the conventional products to meet the specific requirement of these special industries better.

●Diamond powder special for PDC

FDP and HDP series products are subjected to the high-purity treatment with the special post-treatment process, so as to ensure that the metallic and nonmetallic impurity elements on the product surface have very low content, the tap density of particles is improved by virtue of reasonable grain composition, thus, the product is stabilized more easily and grown in a combined manner when synthesizing the compact.

It is applicable toTSP , high-end PDC, metal bond and vitrified bond grinding toos, polycrystalline drawing die, etc.

  

单晶金刚石微粉

 

●Diamond powder special for electroplated diamond tool SFDP-2

The particle size distribution of product is especially concentrated due to the strictly controlled classification production process, thereby removing the noneffective fine particles and coarse particles causing the scratch easily better, substantially increasing the effective grain proportion, improving the processing efficiency of workpiece, and reducing the reject ratio.

It is applicable to the various high-precision electroplated diamond grinding wheels, abrasive disk, cutter, electroplated diamond wire, ultrathin saw blade, etc.

  

单晶金刚石微粉

 

●Diamond powder special for fine polishing SFDP-3

It is specially aimed at the fine-grained products in the high-end polishing field, the effective shaping and grading cannot be carried out on 1μm fine particles through traditional process, and a lot of irregular and oversize particles exist in the conventional product, which is the core factor directly causing the high polishing efficiency but bad polishing effect. Due to breaking through the technical obstacle of shaping and grading of fine size diamond powder, we can shape and grade the 50nm diamond particles effectively, which ensures the narrow distribution of products. Completely-removed oversize particles can ensure it won’t cause deep scratch during the polishing process.

It is applicable to the precision grinding and polishing of high-end n gems, lens, metallographic consumables, LCD panel, liquid crystal glass, sapphire, quartz plate, LED sapphire substrate and ceramic materials..

  

单晶金刚石微粉

100nm product before shaping

单晶金刚石微粉

100nm product after shaping

●Diamond powder special for hard and brittle material SFDP-4

Based on the characteristics and processing requirement of hard and brittle material, the round corner and roughening treatment are carried out on the particles with the special shaping process, so as to ensure that each particle is perfectly round and free of edges and corners. The rough surface of particles obviously enhance the holding force between diamond and workpiece. The blocky shape can avoid the edge breakage and scratching of hard and brittle material during processing.

It is applicable to process the electroplated diamond cutters and grinding wheels which are special for hard and brittle material.

 

单晶金刚石微粉

Available Specifications:

specification
Median
μm)
CDP
FDP
HDP
SFDP-1
SFDP-2
SFDP-3
SFDP-4
0-0.05
0.05
 
 
 
0-0.08
0.08
 
 
 
0-0.1
0.1
 
 
 
0-0.25
0.2
 
 
 
0-0.5
0.3
 
 
 
0-1
0.5
 
 
0.5-1.5
0.8
 
 
0-2
1.0
 
 
1-2
1.4
 
 
1-3
1.8
 
 
2-4
2.5
 
 
3-6
3.5
 
 
4-8
5.0
 
 
5-10
6.5
 
 
6-12
8.5
 
 
8-12
10
 
8-16
12
 
10-20
15
 
15-25
18
 
20-30
22
 
20-40
26
 
30-40
30
 
40-60
40
 
50-70
50
 
60-80
60
 

Note: those in the table are the conventional particle size, and the products with other particle sizes can be provided according to the customer requirements.


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