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Poly Diamond Slurry
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Poly Diamond Slurry

Characteristics: ★ Fine polycrystalline diamond materials. ★ Superhigh cutting force and surface finish in the processing of high hardness wafers. ★ Different carriers are suitable for different fields. Available Sizes:
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Product description
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Characteristics:

★ Fine polycrystalline diamond materials.

★ Superhigh cutting force and surface finish in the processing of high hardness wafers.

★ Different carriers are suitable for different fields.

Available Sizes:

Size(μm)
0.25
0.5
1
3
4
6
Media
Water/Oil
Water/Oil
Water/Oil
Water/Oil
Water/Oil
Water/Oil

Remarks: Special sizes can be tailor-made.

Applications:

1.Semiconductor wafer processing: such as sapphire substrate, SiC wafer and sapphire window film.

2.Ceramic processing: such as Zirconia fingerprint identification chip, Zirconia ceramic mobile phone back cover and other functional ceramics.

3. Metal processing: such as stainless steel, die steel, aluminum alloy and other metal materials.

Poly Diamond Slurry

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